Assembly Engineer
Intel Chengdu site is a 4-in-1 manufacturing powerhouse. Integrating not just assembly and test capabilities, but also die prep and advanced test technology, Intel Chengdu is a critical supply chain node in Intel’s global operations. To date, the site has produced more than 2.23 billion units and developed into the lead assembly and test manufacturing (ATM) site for the company.
In this position, you are required to deal with new technologies and be able to solve tough technical problems with innovative solutions. You will have opportunities to be part of the design team for the world’s leading edge CPUs. If you are a person has the passion to make a difference when facing challenges, or if you are kind of people always willing to come out of comfortable zone, come to join us!
Your responsibilities will be:
-Developing new or modified process formulations, defining processing or handling
equipment requirements and specifications, and reviewing processing techniques
and methods applied in the manufacturing process.
-Process control and equipment qualification, new technology introduction on
assigned job position to make sure successful volume ramping up by hitting
required targets.
-Utilize statistical and Six Sigma tools to deep analysis data derived from
variable factors and scenarios targeting process optimization and root cause
identification related to automated equipment.
-Responsible for planning and leading projects involving definition and
selection of new concepts and approaches in the processing or development of
new or improved processes in assembly.
-Collaborate with cross-functional teams in local and abroad to identify and
mitigate risks from both quality and productivity perspective to ensure new
product smooth transfer and/or high volume product yield performance.
Qualification:
· Bachelor and above degree in mechanics/electrics/material/automation or related major.
· English communication capability in reading/writing/speaking.
· Knowledge in database, SQL and coding experience is preferred.
· Good communication and interconnection skills.